Welcome to the IKCEST
congatec Announces First COM-HPC and Next-Gen COM Express

In parallel with the 11th Gen Intel Core processor launch (code named "Tiger Lake"), congatec announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module.

According to the company, both solutions are designed to provide engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC's broader interfaces. Also, per the company, OEMs will benefit from the performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel Core processors deliver to the high-end computing sector.

Besides PCIe Gen 4, the new congatec Computer-on-Modules with low-power 11th Gen Intel Core processors also offer USB 4.0, which is based on Intel's Thunderbolt technology. USB 4.0 supports ideal data transfer rates of up to 40 Gbit/s and tunneling of PCIe 4.0 as well as DP-Alt mode supporting video signals of up to 8k resolution with 10-bit HDR at 60 Hz.

The COM-HPC Client size A module conga-HPC/cTLU as well as the COM Express Compact conga-TC570 will become available with the 11th Gen Intel Core processors. According to the company, both modules are the first to support PCIe x4 in Gen 4 quality to connect external peripherals with large bandwidth. In addition, designers can leverage 8x PCIe Gen 3.0 x1 lanes. Where the COM-HPC module offers latest 2x USB 4.0 and 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification.

Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules. Comprehensive board support packages are provided for all leading OS's like Linux, Windows, and Chrome, as well as hypervisor support from Real Time Systems.

For more information, visit: congatec.com/11th-gen-intel-core/

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

Follow on Twitter Follow on Linkedin Visit Website More Content by Tiera Oliver

Original Text (This is the original text for your reference.)

In parallel with the 11th Gen Intel Core processor launch (code named "Tiger Lake"), congatec announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module.

According to the company, both solutions are designed to provide engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC's broader interfaces. Also, per the company, OEMs will benefit from the performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel Core processors deliver to the high-end computing sector.

Besides PCIe Gen 4, the new congatec Computer-on-Modules with low-power 11th Gen Intel Core processors also offer USB 4.0, which is based on Intel's Thunderbolt technology. USB 4.0 supports ideal data transfer rates of up to 40 Gbit/s and tunneling of PCIe 4.0 as well as DP-Alt mode supporting video signals of up to 8k resolution with 10-bit HDR at 60 Hz.

The COM-HPC Client size A module conga-HPC/cTLU as well as the COM Express Compact conga-TC570 will become available with the 11th Gen Intel Core processors. According to the company, both modules are the first to support PCIe x4 in Gen 4 quality to connect external peripherals with large bandwidth. In addition, designers can leverage 8x PCIe Gen 3.0 x1 lanes. Where the COM-HPC module offers latest 2x USB 4.0 and 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification.

Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules. Comprehensive board support packages are provided for all leading OS's like Linux, Windows, and Chrome, as well as hypervisor support from Real Time Systems.

For more information, visit: congatec.com/11th-gen-intel-core/

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

Follow on Twitter Follow on Linkedin Visit Website More Content by Tiera Oliver
Comments

    Something to say?

    Log in or Sign up for free

    Disclaimer: The translated content is provided by third-party translation service providers, and IKCEST shall not assume any responsibility for the accuracy and legality of the content.
    Translate engine
    Article's language
    English
    中文
    Pусск
    Français
    Español
    العربية
    Português
    Kikongo
    Dutch
    kiswahili
    هَوُسَ
    IsiZulu
    Action
    Related

    Report

    Select your report category*



    Reason*



    By pressing send, your feedback will be used to improve IKCEST. Your privacy will be protected.

    Submit
    Cancel