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Huawei introduces latest tri-fold smartphone featuring new Kirin 9050 Pro chip

Huawei Technologies Co launched its second-generation tri-fold smartphone, the Mate XT 2, at an event in Guangzhou on Monday. The phone features the company's latest Kirin 9050 Pro chipset — the industry's first high-performance chip to adopt the company's "logic-folding" technology.

The launch marks Huawei's first Kirin chip unveiling at a flagship event since the Mate 40 global launch six years ago.

The Kirin 9050 Pro arranges logic units in layered stacks within a single chip, akin to upgrading from a single-story layout to a duplex, with vertical interconnect channels functioning like installed "elevators". This architecture shortens signal transmission paths, reduces latency, and delivers superior performance.

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Huawei Technologies Co launched its second-generation tri-fold smartphone, the Mate XT 2, at an event in Guangzhou on Monday. The phone features the company's latest Kirin 9050 Pro chipset — the industry's first high-performance chip to adopt the company's "logic-folding" technology.

The launch marks Huawei's first Kirin chip unveiling at a flagship event since the Mate 40 global launch six years ago.

The Kirin 9050 Pro arranges logic units in layered stacks within a single chip, akin to upgrading from a single-story layout to a duplex, with vertical interconnect channels functioning like installed "elevators". This architecture shortens signal transmission paths, reduces latency, and delivers superior performance.

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